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September 1999

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Subject:
Hot: Copper plating thickness -Reply
From:
Alain Savard <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 29 Sep 1999 14:32:06 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (57 lines) 
Hi Ken,

  Verify the thickness as per IPC-TM-650, method number 2.1.1. This is suggested
by the IPC A-600, section 3.3.6.

  Verify also IPC-6012, section 3.2.6.2 and table 3-2 (under average copper, and
minimum thin areas).

  Although in the present case, it does seem like a reject.

Alain Savard, B.Sc.
CAE Electronics Ltd.

>>> Ken Patel <[log in to unmask]> 09/29/99 01:42pm >>>
If my requirement for the copper plating is 0.001" minimum (as spelled out
on my fab drawing) and if I am reading it between .0004"-.001", is it
rejects or not?. I tried to look at IPC-6012 which is calling out avg copper
thickness. I don't how easy to get ave #. This is clearly a reject to me.
But I am looking for an expert opinion on the subject. Via Hole in question
is 16 mil +3 mil / -10 mils.

re,
ken patel
______________________________________________________
Ken Patel                       Phone:  (408) 490-6804
1708 McCarthy Blvd.             Fax:    (408) 490-6859
Milpitas, CA 95035              Beeper: (888) 769-1808

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