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September 1999

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Subject:
From:
Miguel Vallejo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 28 Sep 1999 19:07:21 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines)
Hi,
Is expose basis metal on pcb's circuitry, as a result of assembly
process scratches, and not as a defective solder mask, acceptable under
IPC 610/J-STD-001?
I have concluded that IPC-610 does not addresses this as a condition,
other then being mentioned as an element of a rejectable solder mask
degradation, 7.2.1, figure 7-9. I have, also, noticed that correction
amendment, January 1996, removed the expose bare copper from the
rejectable conditions for class 2,3 on 7.2.2, figure 7-12.

I'm really looking at tiny spots (approx. .010" dia. max). Any help
would be appreciated.

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