Me again, Bertrand,
 happened to open old files and found a report I used many years ago: "Predicting Plated-Through-Hole Reliability in High Temperature Manufacturing Processes"  written by technicians from DEC. Based on Coffin-Manson and Engelmaier models.  If you want a copy, just tell me. If your e-post server accepts up to 5M, I can mail it to you. /Ingemar



 Bertrand, how are you at Alcatel, just fine I hope.
 If I were you I would pay a lot of attention to the WETTING. Maybe that's what you mean with boundary. Enormous, big Alcatel must have lots themselves about the matter, don't you think? We have reports, certainly, but I don't have the time to dig in such old history. I recommend you to call Stig Ek at telephone 46-8-719 7896. He has been working with such questions within Ericsson for decades, there are a lot of other guys, but THC is a historic technology and the oldtimers disapperar one by one. Good Luck.
Ingemar Hernefjord
Ericsson Microwave Systems

>Hello techneters,
>
>I repeat my previous question about component solderabiliy.
>I am looking for some informations about electrical through hole component
>(THC) solderability.
>Actually, some problems occur when we have to solder a component on a
>multilayer printed card. We are faced to the problem when 3 ground layers at
>least are connected to the component metalized hole.
>Some finite element simulations of the problem have revealed that the
following
>parameters are very influent:
>
>- Thermal capacity of the component
>- Lead material of the component
>- Number of connected ground layers to the component hole
>- Layers position
>- Boundary conditions
>
>I am looking for some reference, specifications and/or test results about it.
>
>Thank you
>
>Bertrand DESSART
>Thermal and Mechanical department
>ALCATEL ETCA
>Charleroi BELGIUM

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