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September 1999

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Subject:
From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 27 Sep 1999 11:03:09 -0700
Content-Type:
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text/plain (84 lines)
Rather than send out multiple messages:
1) COB, etc.: There is a book that is relatively up to date: "Flip Chip
Technologies" edited by John Lau.  There is much activity on flip-chip, so
I'd look up the more current literature if it's important to you.  You might
peruse the http://www.ieee.org/conferences/tag/tag.html web site and choose
Packaging.  If your in a city with a good (very major) university (I am
not), your library is the best bet.

2) Plasma clean/IC's: don't proceed until you talk with someone with first
hand experience and deep knowledge.  You can trash your chips.

3) Wire bonding: A rough surface (e.g., spiked) will just "moosh" (for lack
of a better term) all around.  Surface cleanliness depends on how you clean
your surface and the residue it leaves behind.  Water and oxides will always
be present (except Au oxide is unstable at room temperature).  Thin films
and interfaces can be extremely strong.  The strength of thin films can be
1000X higher than bulk equivalents and their other properties (e.g.,
electrical) vary as well with thickness.  Auger (pronounced o-jay (a french
"je") for you non-surface scientists) is useful because it can easily
explore the composition of the top 500-3000 angstroms (it's accuracy is
about 50 A).  But you pay $150/hr (one way or another in a big company).
But that's only for gross contamination during film deposition (plating or
sputtering).  Also, AES (another way to say Auger) is not useful on rough
surfaces because you can't tell it's depth from the surface.  About solving
this for you, I don't think I can from here.  Yes, I'm a thin film
metallurgist (presently looking for some work in Portland in this field if
any of you have connections), but the problem you have is very
equipment/metal-system dependent.  It's like long distance surgury.  I am
available as a consultant (but I get expensive), but first I recommend
calling your suppliers and trying to network through them to find an
industrial partner (nearby) that you can visit and get ideas.  Serious
problems are not solved in a day or even a week (which many of my clients
loath to hear).

Carey


-----Original Message-----
From: Nicholas LAI <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, September 27, 1999 12:20 AM
Subject: [TN] COB,FP,TAB


>Hello...
>There is some terms I want  to know.  COB, FP,TAB?
>
>Can anyone provide some info to me.. or related web sites....
>
>Best Regard,,
>Nicholas Lai
>9/27/99
>
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