You may want to identify copper weight, inner as well as outer layer pad
geometry. These will all determine what you may want to try next.

At 02:11 PM 9/27/99 +0200, DESSART wrote:
>Hello techneters,
>
>I repeat my previous question about component solderabiliy.
>I am looking for some informations about electrical through hole component
>(THC) solderability.
>Actually, some problems occur when we have to solder a component on a
>multilayer printed card. We are faced to the problem when 3 ground layers at
>least are connected to the component metalized hole.
>Some finite element simulations of the problem have revealed that the
following
>parameters are very influent:
>
>- Thermal capacity of the component
>- Lead material of the component
>- Number of connected ground layers to the component hole
>- Layers position
>- Boundary conditions
>
>I am looking for some reference, specifications and/or test results about it.
>
>Thank you
>
>Bertrand DESSART
>Thermal and Mechanical department
>ALCATEL ETCA
>Charleroi BELGIUM
>
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