Hi Bertrand! Take a look at IPC specification ANSIJ-STD-002A as a starting point
for answers. Also check out Klein Wassink's book "Soldering in Electronics" ISBN
# 0-901150-14-2 for information. Good Luck.

Dave Hillman
Rockwell Collins
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DESSART <[log in to unmask]> on 09/27/99 07:11:54 AM

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Subject:  [TN] component solderability



Hello techneters,

I repeat my previous question about component solderabiliy.
I am looking for some informations about electrical through hole component
(THC) solderability.
Actually, some problems occur when we have to solder a component on a
multilayer printed card. We are faced to the problem when 3 ground layers at
least are connected to the component metalized hole.
Some finite element simulations of the problem have revealed that the following
parameters are very influent:

- Thermal capacity of the component
- Lead material of the component
- Number of connected ground layers to the component hole
- Layers position
- Boundary conditions

I am looking for some reference, specifications and/or test results about it.

Thank you

Bertrand DESSART
Thermal and Mechanical department
ALCATEL ETCA
Charleroi BELGIUM

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