Bleed from any adhesive can be a problem, but its more of a problem when using conductive
materials in tight spots.
Not every one gets it, but its common enough that some adhesive suppliers have NB (no
bleed, or really: less likely to bleed) versions of their die attach materials.
This came up a few weeks ago for an encapsulation application, maybe some one still has
the exchange on their files as the mechanism and solutions are the  same or you can look
in the archive.

Mike Fenner

----- Original Message -----
From: Christian Skeppstedt (EMW) <[log in to unmask]>
To: <[log in to unmask]>
Sent: 24 September 1999 12:12
Subject: [TN] Bleed-out


> Hello,
>
> Has anyone experienced bleed-out of conductive adhesives after dispensing?
>
> We have seen resin from the conductive adhesive contaminate areas around the pad. The
contamination spreads to nearby areas and makes it very difficult to wire bond onto. On a
different substrate, the same adhesive yields much less or no bleed-out.
>
> What are the reasons behind this behaviour? What can one do about it??
>
> /Cecilia Alkhagen
> Ericsson Microwave Systems AB
>
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