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September 1999

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Subject:
BGA voids
From:
"Joy, Stephen C" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 25 Sep 1999 15:44:25 -0700
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text/plain
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text/plain (22 lines) 
Technetters,
How do BGA solder ball voids form in the assembly process?
I understand that they are generally due to a pad that is unsolderable, but
what is the mechanism?
Is this flux residue that volatizes, impurities or something else?
Thanks,
Steve

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