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September 1999

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Subject:
From:
Carl Ray <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 Sep 1999 09:13:41 -0500
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What advances have been made in the last few years to clean (DI Water) no
clean flux residue from wave solder fluxes and solder pastes? I have a
customer who is in Aerospace and they want use to look into no clean process
and still meet IPC 610 Class 3 specs for PCB cleanliness prior to conformal
coat. Any ideas would be helpful.
Carl Ray
Engineering  Supervisor
256-494-3247 Direct line
256-492-8997 ext. 272
256-494-0625 Fax
[log in to unmask]

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