We are looking at current trends in 0402 land patterns and effects
on tombstoning. This will result in a DOE incorporating the current
varieties of existing designs to improve post-reflow quality levels. It will
also incorporate various surface finishes and stencil modifications. I would
like feedback on any types of pad layouts (and stencil design) we have not
yet considered, to allow incorporation into the DOE. We are currently
looking at following land patterns:

- IPC Standard Layout
- SMT Plus Layout
- Siemens Inverted Horseshoe
- Round Pads (Layout TBD)

        Any help that could be offered (either via TechNet or offlline)
would be greatly appreciated, including references to studies previously
conducted....

Mike McMonagle
PCA Process Engineering Supervisor
K*Tec Electronics
1111 Gillingham Lane
Sugar Land, TX  77478
(281) 243-5639 Phone
(281) 243-5539 Fax
[log in to unmask]

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