To All,
I am interested in finding out what the difference is between what is
called a laminate void, and a spot of delamination or blister.
Because of the great difference in acceptable size between the 2 defects,
it seems to be important to be able to differentiate them.
Why is such a small (anything greater than .003") void unacceptable (IPC
600 3.1.1), but a larger delamination spot acceptable as long as it doesn't
violate conditions spelled out in IPC 600 2.3.2.
Any information as to how to identify the differences, and why one is more
"acceptable" in terms of size would be greatly appreciated.
Thank you,
Brian Lane

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