We are using a DEK 265 with capability of control of the "snap-off"

-----Original Message-----
From: Taheri, Kamran [mailto:[log in to unmask]]
Sent: Wednesday, September 22, 1999 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Need to know


I don't know what kind of printer you are using. But, usually the board
pulls away "snaps-off" from the stencil. What type of stencil are you using?
Do you have a slow snap-off option in your printer?

> -----Original Message-----
> From: Steffen, Don E [SMTP:[log in to unmask]]
> Sent: Wednesday, September 22, 1999 12:24 PM
> To:   [log in to unmask]
> Subject:      [TN] Need to know
>
> Technetters
>
> I have a situation where I need the advice from the Technetters. I have an
> assembly with HASL. In order to stay within the aspect ratio guidelines, I
> must use a stencil that has a .0085 aperature opening, a 20 mil spacing,
> and
> I must use a 6 mil stencil. I tried this and when the stencil pulled away,
> the surface tension pulled away the solder paste from the pad area. If I
> were to go to a 5 mil stencil (which is outside the Aspect Ratio
> guidelines), would this help me with keeping the solder paste on the pad
> and
> not on the stencil? Or is there another approach that I should consider
> instead of going to another stencil thickness? Any help you can give me
> would be appreciated
>
> Donn E Steffen
> Senior Quality Engineer
> VDO Control Systems
> Auburn, IN 46706
> Phone (219)925-8887
> Fax (219)925-8710
> Email: [log in to unmask]
>
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