Technetters

I have a situation where I need the advice from the Technetters. I have an
assembly with HASL. In order to stay within the aspect ratio guidelines, I
must use a stencil that has a .0085 aperature opening, a 20 mil spacing, and
I must use a 6 mil stencil. I tried this and when the stencil pulled away,
the surface tension pulled away the solder paste from the pad area. If I
were to go to a 5 mil stencil (which is outside the Aspect Ratio
guidelines), would this help me with keeping the solder paste on the pad and
not on the stencil? Or is there another approach that I should consider
instead of going to another stencil thickness? Any help you can give me
would be appreciated

Donn E Steffen
Senior Quality Engineer
VDO Control Systems
Auburn, IN 46706
Phone (219)925-8887
Fax (219)925-8710
Email: [log in to unmask]

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