Hi Dessart,

        The 3 ground planes are huge heat sinks, chances are the solder
joint will never look ideal.
        If it does you probably fried some other part of the card.

        I'm sure you could test it with some dummy panels to be sure.

        Hans

So that you will hear me my words sometimes grow thin as the tracks of the
gulls on the beaches. - Pablo Neruda
~~~~~~~~
Hans M. Hinners                                 WR-ALC/LYPME Bldg. 640
Materials Engineer                                      380 Second Street,
Suite 104
Manufacturing Eng. Sec.                         Robins AFB GA 31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)   912-926-7974 (Fax)
mailto:[log in to unmask]


> I am looking for some informations about electrical through hole component
> (THC) solderability.
> Actually, some problems occur when we have to solder a component on a
> multilayer printed card. We are faced to the problem when 3 ground layers
> at
> least are connected to the component hole.
> Some finite element simulations of the problem have revealed that the
> following
> parameters are very influent:
>
> - Thermal capacity of the component
> - Lead material of the component
> - Number of connected ground layers to the component hole
> - Layers position
> - Boundary conditions
>
> I am looking for some reference, specifications and/or test results about
> it.
>
> Thank you
>
> Bertrand DESSART
> Thermal and Mechanical department
> ALCATEL ETCA
> Charleroi BELGIUM
>
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