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September 1999

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Sep 1999 14:56:08 EDT
Content-Type:
text/plain
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text/plain (31 lines)
Hi Michael,
You did not give the pitch you are using; with the dimensions you did give, I
conclude that the actual column height is about 60 mils; beware of too
slender columns. You also do not state what the Solder Column Interposer
material is; again assuming, if you solder attach a ceramic BGA to Solder
Column Interposer it is also made of ceramic. However, if it is 'a socket
type device', than I do not see the need for the solder columns. Please
provide more information.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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