Why they are using the interposer, I don't know (I'm waiting for the answer)
(I'm assuming solderability and rework purposes)

The spacing is of the columns is 1.27mm

I'm more concerned with the interposer being mounted on the board.
Can I use the same pad size as I would a bga or larger?
Does the height of this component cause any instability during soldering or is
it a special case that needs to be done seperatly? Are there any solderability
problems using the interposer?

Mike Kuczynski


> I'm having some trouble completely understanding what I think to be two
> issues. One is a BGA installed on the interposer that is has columns
> attached to the board surface.
>
> We use such schemes down to .8 mm with over 1000 I/O's for very special,
> "hand holding" processes. For pure ceramic column grid arrays (CCGA), we
> obviously paste and reflow solder directly to the boards.
>
> I guess I'm asking questions. Is what you need a function of the interposer
> or the BGA? Also, what spacing is required and why the interposer, though I
> believe I know that answer?
>
> Earl Moon
> ----- Original Message -----
> From: Kuczynski Michael <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Tuesday, September 21, 1999 9:17 AM
> Subject: [TN] Column Grid Array
>
>
>  I'm looking for any help, suggestions or pitfalls in making a footprint
> pattern and assembly processes for a column grid array.
>
>  Its a ball grid array, except it sits on a socket type device (1.695mm
> [.0667in] high max.) called a Solder Column Interposer. The overall height
  with the bga is 4.04mm [.1590in]
> >
> > The device itself is cermaic.
> >
> > Thanks in Advance,
> >
> > Michael Kuczynski       Librarian/Sr. Designer
> > Allied Signal           201-393-2122 (Phone)
> > 699 Rt46E E/K4          201-393-2357 (Fax)
> > Teterboro NJ 07608
> > [log in to unmask]
> > [log in to unmask]

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