I'm looking for any help, suggestions or pitfalls in making a footprint pattern
and assembly processes for a column grid array.

Its a ball grid array, except it sits on a socket type device (1.695mm [.0667in]
high max.) called a Solder Column Interposer. The overall height with the bga is
4.04mm [.1590in]

The device itself is cermaic.

Thanks in Advance,

Michael Kuczynski       Librarian/Sr. Designer
Allied Signal           201-393-2122 (Phone)
699 Rt46E E/K4          201-393-2357 (Fax)
Teterboro NJ 07608
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