Phil, Is that with or without Nitrogen?

Regards,
Mike Yuen

> -----Original Message-----
> From: Phil Zarrow [SMTP:[log in to unmask]]
> Sent: Friday, September 17, 1999 11:07 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Bottom Side reflow.
>
> In my papers on double sided reflow and Intrusive Soldering, I use the
> formula:
>
> Weight of component in grams
> total pad to lead mating surface area (in inches)
>
> and if the result is < or equal to 30 grams, the component will not fall
> off.
>
> Last week, at the SMTA Int'l conference in San Jose, Bob Willis and I
> compared further notes and experience on this.  We have both used
> components
> that exceeded 30 grams/in sq but we are sticking with this number.  This
> incorporates a lot of components including most fine pitch QFPs, TSOPs, as
> well as 68 pin PLCC.  Trouble components are larger mass components and
> many
> ceramics including some large tantalums.  So experiment with any component
> first.
> It also assumes that you have a smooth running reflow oven conveyor - no
> "shake and bake".
> Regards,
> Phil Zarrow
> ITM, Inc.
> Durham, NH  USA
> www.ITM-SMT.com
>
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