Morning, Jeff,

We changed to vacuum oven, because of too much built-in voids when conveyor soldered. That was large semiconductor chips for heatspreaders (the metal plating outgassed). X-ray showed significant improvement. To get max wetting, we also plasma clean heatspreaders before assembly starts. Guess you ask for semi chips also. Don't know what help this may give you...
Ingemar Hernefjord
Ericsson Microwave Systems

-----Original Message-----
From: JEFF PERKINS [mailto:[log in to unmask]]
Sent: den 17 september 1999 18:36
To: [log in to unmask]
Subject: [TN] Fluxless soldering (AuSn) with SMT reflow ovens




        Is anyone doing fluxless soldering with AuSn eutectic preforms in SMT reflow ovens (inline conveyor, not batch)?

                Any problem achieving temperature (eutectic point 280C)?
                Any problems in Nitrogen environment?
                How about preforms of other compositions?


        Thanks,
                Jeff Perkins
                Epitaxx

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