Thanks, Dwight, also good idea, but as the object is very small, the resolution must be'
<<1 micron. Hate to show the japs that we can't examine ourselves, so I will try even IR, as you say. Will ask our waferfab what type of IR they have. /Ingemar
-----Original Message-----
From: Dwight Mattix [mailto:[log in to unmask]]
Sent: den 17 september 1999 18:07
To: [log in to unmask]
Subject: Re: [TN] HISTACK, IBM-type, japs
We've had good look locating shorts/leakage with IR imaging. Our
camera/software (Inframetrics) supports a comparison of the thermal delta
between different assemblies -- super discriminating.
At 09:01 AM 9/17/99 +0100, Roger Massey-G14195 wrote:
> Ingemar,
>
> Dont know if its too late to offer anything on this (been away a
> couple of days), but if the parts a "daisy chain" cant you identify
> roughly where its failed, and then cross section real careful about
> that area only?
> I dont know if it will work, but have you considered dye
> penetration? I guess this needs a crack up on the surface to allow
> penetration but you may be lucky?
> Other possible ideas, but Im really starting to clutch at straws
> are
> Eddy Current methods, unsure of detection limit or noise
> effects due to feature size?
> Acoustic routes, which work on the idea that flaws in
> joints etc generate microsound waves under thermal loading, again,
> dont know if its suitable, but find an expert and ask them
>
> If all else fails you could try asking somebody like the
> Institute of None Destructive Testing, Never used them myself, but I
> guess they do destrucive methods to, find them at
> http://www.bindt.org/
>
>
> Good luck, and let us know if you get anywhere, never know when
> we need to find the needle in the haystack.
>
>
> Roger
> Motorola AIEG
>
>
>______________________________ Reply Separator
>_________________________________
>Subject: Re: [TN] HISTACK, IBM-type, japs
>Author: "TechNet E-Mail Forum." <[log in to unmask]> at #email
>Date: 16/09/99 22:15
>
>
>Another excellent shop is Hewlett-Packard (name changed recently???) in
>Santa Rosa. They know plating better than any one I know (including IBM).
>
>-----Original Message-----
>From: joyce <[log in to unmask]>
>To: [log in to unmask] <[log in to unmask]>
>Date: Thursday, September 16, 1999 4:03 PM
>Subject: Re: [TN] HISTACK, IBM-type, japs
>
>
>>wow! blame the test vehicle for the failure on ESS (based on the
>>daisychain...I assume you are doing qualification and failed in
>>T/H/B)...Blame the Doctors too on the design ...gee, really should just let
>>you "swim or sink" on your own...but, I do like Big blue and IBM-guys...do
>>not want them got beatten for no reason at all!
>>based on the limited information you provided, here is what I would do if I
>>were you:
>>(1) pay IBM ($)for Failure analysis...If it is SIR type of test vehicle
>>(with daisychain), I think you may need LSI tester to pin point where is
>the
>>leak or short. I believe they have a component lab and FA lab for doing
>>outside work (at least used to be).
>>(2) Pay IBM well ($$) for root cause analysis (you may have to open your
>>material/process in order to get some real benefit of root cause. "Window
>>dressing" will lead you more costly FA).
>>(3) Pay IBM more (big time $$$$) for training some of your personnel to do
>>proper FA. (be willing to spend sleepless nights to make sure you
>>understand the steps and why!)...send someone with background in FA and
>>design/process...Believe me, it is a good investment...You may have to sign
>>some non-disclosure agreement.. watch what you sign...(you may sign off
>your
>>day dream and nightmare too)..
>>(4) look like so far the only 2 people replied your e-mail are Dr.s! stop
>>bashing us... you may need us someday (like as a drinking buddy).
>> jk
>>At 09:12 AM 9/16/99 +0200, you wrote:
>>>Guten Wienerschnitzel, netters,
>>>challenge for an IBM-guy if he reads (no, of course he doesn't, big Blue
>>too big) , maybe my mate and competitor Bev can rise his eyebrow and move
>>his finger to the keyboard. Topic: multilayer 3D "boards" with IBMs liftoff
>>and PI dielectric. Reactive Ion etch (O2/He RIE) through mask for removing
>>PI, followed by WSiN sputter for biting and low current electroplating for
>>first step making the vias. Vias are finally O2 plasma, SF6 RIE'd. Now,
>most
>>seems maybe familiar to you, but, the problem is that the conductors are
>>only 4um wide and the vias 1um in diameter. Test "board" consists of single
>>to two layers with very short conductors, daysichained, let's say a hundred
>>such strips. See it in front of you: gold, under is the via, via goes
>>horizontally some um, goes up to next gold, .. up, down, up down, like
>>chaining an ordinarey PWB, but one decade smaller. And, PI is the
>>dielectric, approx 2um thick. Now, palomas, the Q:
>>>when these "boards" are temcycled we get interrupts somewhere in the
>>daisychain, seen as RF signal anomalies. How on earth do we analyse?
>>Ordinary SEM of surface tells nothing of what's under the conductor.
>>Finefocus Xray has unsufficient resolution for finding microcracks.
>>Sonoscan, no. Cross-sectioning, no, weeks of job, little chanse of finding
>>rupture. Reactive etching will heat and possibly take both Gold and PI. Wet
>>etching, e.g. KaC? Takes Au, but what do you do with the W under Au? Agree,
>>more like semiconductor techs.
>>>
>>>Oftenly when we have to do with the japs, we describe with hands, paper,
>>mail, photos and words, and they reply 'yes', 'yes', which is oftenly of
>>little help. So, Bev (I'm sure you have a recipe in your pocket) and like,
>>what do I do with the drunken saylor?
>>>Aussilek, give up, you can't be specialist on everything, you must have
>>some limitation, please, tell that you are a human and not a Cray. (on that
>>isle you may say crayfish, I don' t know).
>>>
>>>Cu?
>>>
>>>Ingemar Hernefjord
>>>Ericsson Microwave Systems
>>>
>>>PS. With HISTACK, I mean that our test samples remind of this EU-thing,
>but
>>does not belong to EU at all.
>>>
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