TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Glenn Pelkey <[log in to unmask]>
Reply To:
Date:
Fri, 17 Sep 1999 11:52:46 PDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (47 lines)
Electromigration as defined by the transport of metal atoms along interfaces,
between grains, and leaving a void.  Influenced by temperature and current
density.  The temperature activation energy I have listed for aluminium is 0.5
eV  (although, other authors list 0.4 to 0.5 eV, 0.4 to 0.8).  Other metals
list a range of 0.5 to 1.2 eV.

Electromigration as defined by the transport of metal ions across an
insulating surface forming a conductive path.  Also called Electrochemical
Migration, Ionic Migration, or Electrolytic Corrosion.  Requires some level of
moisture and voltage potential, and may require an ionic contaminate, although
not always.  The temperature activation energy for aluminum is 0.9 eV
independent of humidity.  For copper, I haven't found anything specific.
Maybe someone else has.  But, metalization in general lists 0.3 to 0.9 eV.

Hope this helps.  Maybe one of the experts on the forum will have a better
answer.

Glenn

Sources:  D.S. Peck, O.D. Trapp, O. Hallberg, J.N. Thielman


Wanner Bernhard <[log in to unmask]> Wrote:
|
|         Hi Techies, 2 short questions:
|         Do anybody know the elasticity modulus of Dow Corning 160 at -25oc
| and -40oC?
|         Do anybody know "the" activation energy (in eV) of the
| electromigration effect?
|
|         thanks
|         Bernhard

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2