Allen,
I believe the guidelines in certain requirements will not list maximums. For
most maximum requirements the solder may not contact the package body. If
you have an excess of solder on a pad I believe you may see other defects.
VBK
Vincent B. Kinol CQE
Applications Engineer
OMG Americas Microbond
[log in to unmask]
Phone 919-544-8090 x298
FAX 919-544-8090


        -----Original Message-----
        From:   Kluz, Allen E. [SMTP:[log in to unmask]]
        Sent:   Friday, September 17, 1999 10:42 AM
        To:     [log in to unmask]
        Subject:        [TN] maximum solder joint thickness

        Technetters,
        I've been searching through the IPC-A-610: Acceptability of
Electronic Assemblies Guidelines, and can't find anything on guidelines for
maximum joint thickness (from the pad to the lead). The manual refers to as
the "G" dimension, which clearly identifies the minimum thickness'.  Does
anyone know of guideline for this and where it's stated?  I'm looking for a
round lead in particular.

        Thanks in advance.


        Allen Kluz
        Supplier Quality Engineer
        [log in to unmask]


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