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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 17 Sep 1999 10:20:52 -0700 |
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I'm paranoid about attachments and viruses. Can we not include attachments?
-----Original Message-----
From: Nancy Trumbull <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, September 17, 1999 9:32 AM
Subject: Re: [TN] maximum solder joint thickness
Hi Allen,
I would like to help you but I'm not sure about your question.
Please give a little more information.
1. What side of the PCB
2. Plated through or not
3. Joint = Solder thickness yes
4. What page are you looking on
Your question is how thick can the solder be from the pad to
the lead.
Please open the attachment and let me know if this is what your
are asking.
Jack Crawford will know I'm sure
Or e-mail me
[log in to unmask]
Nancy
>>> "Kluz, Allen E." <[log in to unmask]> 09/17/99 10:42AM >>>
Technetters,
I've been searching through the IPC-A-610: Acceptability of Electronic
Assemblies Guidelines, and can't find anything on guidelines for maximum
joint thickness (from the pad to the lead). The manual refers to as the "G"
dimension, which clearly identifies the minimum thickness'. Does anyone
know of guideline for this and where it's stated? I'm looking for a round
lead in particular.
Thanks in advance.
Allen Kluz
Supplier Quality Engineer
[log in to unmask]
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