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September 1999

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Subject:
From:
"Hurst, Joe" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Sep 1999 11:51:10 -0400
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Don
        A number that was seen on this forum at one time was 30 grams of
component mass per 1 square inch of total pad area.  I have used this on
some oscillators and it was OK.

Joe Hurst, CET
PWB Designer
Computing Devices Canada
A General Dynamics Company
[log in to unmask]
613-596-7816


-----Original Message-----
From: Steffen, Don E [mailto:[log in to unmask]]
Sent: Friday, September 17, 1999 11:35 AM
To: [log in to unmask]
Subject: [TN] Bottom Side reflow.


Technetters

We are doing a double side reflow. What is the formula to determine the
maximum component mass double side reflow so the components will not fall
off during reflow. I realize it is also necessary to know the amount a
surface tension also necessary. Is there a point, such as 14 pin or less IC
that I can safely process through the reflow. What is the experience of the
industry? I appreciate any responses you can provide!

Donn E Steffen
Senior Quality Engineer
VDO Control Systems
Auburn, IN 46706
Phone (219)925-8887
Fax (219)925-8710
Email: [log in to unmask]

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