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September 1999

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Subject:
From:
"Hollandsworth, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 17 Sep 1999 08:14:23 -0500
Content-Type:
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text/plain (71 lines)
TechNet'ers:
Pat Brooks ask a good question about the plating method, which I missed in
my original question/info e:mail thing-a-ma-bob.

And the answer is . . . Can you tell it's Friday? . . . electroless Nickel
and immersion gold is the plating method.

All have a great weekend.

Ron

-----Original Message-----
From: Hollandsworth, Ron
Sent: Thursday, September 16, 1999 3:12 PM
To: [log in to unmask]
Subject: Subj: Poor Wetting/Solderability/Contamination/????
Importance: Low


Good Day TechNet:
I am experiencing poor wetting, insufficient hole fill, and what appears to
be phosphorus contamination.  Some details are:

1.  Happening/Noticiable after wavesolder operation.
2.  Wavesolder setup is:  230 F  top side board temperature, Low Residue VOC
Free Water Based Flux by Kester, minimal to no solder balls (appears
flux/preheat has sufficient timing), conveyor speed at 3 ft. per minute, and
spray fluxer with pitch/pressure/speed control (good coverage).
3.  Handsoldering seems to work, however, may have selected boards that are
solderable.
4.  Connector leads are within tolerance and board is within tolerance,
however, at max and min tolerance the lead protrusion left is minimal.
Believe it acts like a plug, however, defect characteristics appear on
bottom side of board.
5.  Nickel/Gold board - electroless plating
6.  Relatively fine pitch connectors, however, larger .050 mil connector has
shown poor wetting, insufficient, cantamination, etc., as well as randomly
other parts of board.
7.  Boards are not stored for a long time before use.  Cycle time very short
from dock to line.

I noticed that last week someone else had a problem that is about the same
as this.  We have also tried paste-in-hole for the connectors and it appears
to help significantly, but there is still a problem, still you should be
able to wavesolder these boards and not add an extra step in the process.

Good topic, I think.  Has any one solved this issue or speculation on how to
solve it.   I read the speculations, but it appears to be plaguing other
besides just us at the present time.  Plus it comes and goes.

Looking for clues?????

Ron Hollandsworth
Ops Task Leader
ITT
[log in to unmask]

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