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September 1999

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Subject:
From:
Hinners Hans CIV WRALC/LYPME <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 Sep 1999 00:08:58 +0100
Content-Type:
text/plain
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text/plain (91 lines)
Hi Nicholas,

Here's bare bones details, ask if something doesn't make sense.

Corrections welcome!

First step is common to both make the PTHs conductive - electroless Cu or
more recent chemistry.

Panel plating
        Plate the entire panel.
        Apply the circuit image using Photoresist
        Touch-up/Inspect circuit image - Strip and try again if it's beyond
touch-up
        Etch Circuit Image

Pattern Plating
        Apply the circuit image using Photoresist
        Plate the pattern of the circuit
        Inspect - if it's bad toss it
        Etch Panel

We use panel plating for inner layers (Copper) and pattern plating for outer
layers (Copper and Tin/Lead).

Pro & Con

A problem with Panel Plating is nonuniformity of the plating thickness
across the board.
We sometimes etch a 'picture frame' from around the circuit/board area.

A problem with Pattern Plating is burning (overplating?) isolated runs.
To minimize this effect we will add nonfunctional pads to isolated runs if
the design allows.

I 'Think' of panel plating being better because inner layers have the
critical dimensions - 5 mil lines and 5 mil spaces stuff.

It really depends on what type/part of the board you are interested in.

'We'  (List We) can get into DC versus Pulse versus Reverse Pulse Plating in
the advanced course.
Because I haven't had the pleasure of using anything but DC, yet.

Hans

Air Force Material Command - We keep them flying!
~~~~~~~~
Hans M. Hinners                                 WR-ALC/LYPME Bldg. 640
Materials Engineer                                      380 Second Street,
Suite 104
Manufacturing Eng. Sec.                         Robins AFB GA 31098-1638
912-926-1970 (Voice) 468 - 1970 (DSN)   912-926-7974 (Fax)
[log in to unmask]


> -----Original Message-----
> From: Nicholas LAI [SMTP:[log in to unmask]]
> Sent: Tuesday, August 31, 1999 10:06
> To:   [log in to unmask]
> Subject:      [TN] Plating and pattern plating
>
> Hello
> (1)What is the different between panel plating or pattern plating?
>
> (2)More, I heard that there are two process flows to make the multiayer
> baord on
> plating.
> One is PTH than Panel plating and then pattern plating.
> Second is PTH than pattern plating(there is no panel platting.)
> Which on is better and what is the pros & cons.
>
>
> Best Regard,
> Nicholas Lai
> 9/1/99

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