TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Sep 1999 10:00:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Hi Ivan -

I think you'll find the brush trick to be a real pain, and not a solution to
your problem, especially after it has snagged a few boards and popped them out
of the conveyor onto the floor or into the bowels of the wavesolder machine.

Recommend you concentrate on isolating and correcting the origin of the
micro-solder balls.  I assume you've done all of the normal checks of your
preheat and solder profiles, along with flux chemistry and density.   As a
hint, if your boards have dry film mask, check the compatibility of the mask
and flux very carefully.  The flux manufacturer can probably be of
considerable assistance in this area.

Regards - Kelly

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2