Hello Technet world:
We sporadically get some micro solder balls in our assemblies using Low solids
flux (Alpha's NR-200). It has been suggested to install a rotating brush after
the wave solder process (to remove some of these solder balls) right before the
exit of the boards. I have my reservations about the solder not being completely
solidified, plus the setup portion, as this brush would have to be adjusted
every time we run a different width board.
Does anyone have such a system installed? Is this a feasible situation? Just
wondering.
Thanks in advance for any responses
Ivan

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