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September 1999

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Subject:
From:
"Hamilton, Richard CLE 4454" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 15 Sep 1999 15:51:55 -0700
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Greetings fellow TechNetters,

Before I go to the IPC web site and do a search on this, does anyone know of
any standards or established criteria for peelable solder mask when applied
onto the board? Thickness, separation force required to peel off the board,
temperature to withstand, etc?

Thank you in advance.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

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