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Date: | Wed, 15 Sep 1999 11:09:45 -0700 |
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Edward
There is no "common practice" for BGA's. It depends on the PWB shop and
customer requirements. Also on the BGA density (of connnections).
Microvias range in size from 2-8 mils diameter. Plating is typically
electroplated copper (although the photovia process is being demonstrated by
conductive inks provided by ORMET). Most don't require microvias below 4-5
mils (because of the cost of manufacturing).
There is much more detail to go into, but your question is vague. Do you
need to locate a laser drill shop, board supplier, etc? Or is this
educational?
Shannah Tovah
-----Original Message-----
From: edward Edward Szpruch <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, September 14, 1999 5:06 AM
Subject: [TN] BGA micro-blind vias
>Hi,
>What is the common practice concerning blind-microvias located on BGA pads:
>a) open ? ( 2-3 mills diameter, 2 mills deep)
>b) filled with what ( fill materials,LPI solder mask)?
>c) filled with electroplated copper ?
>Pls advice
>
>Edward Szpruch
>Eltek , Manager of Process Engineering
>P.O.Box 159 ; 49101 Petah Tikva Israel
>Tel ++972 3 9395050 , Fax ++972 3 9309581
>e-mail [log in to unmask]
>
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