Al Writes:
>I have 5 year old plastic SOIC packages on reels and want to dry them out
in
>an oven rather than leave it to the pre-heat of the reflow solder machine.
>Production asked for temperature and time for the SOIC to be in the oven.
>My initial thoughts are to put them in a cold oven and set the thermostat
to
>110'C and leave them baking for 4 hours.

Al, make sure that they need baking.... if they're low pin count SOIC's
they likely dont.
Large >28 Pin PQFPs, TSOPs etc likely DO.

110C in tape will likely melt things. I believe the profile for in-tape
bake is something like
40C for a week, or something close to that. IC vendor websites will have
the appropriate
profile. Beware that hi temp bakes can tend to oxidize the leads, so that
only one
high temp bake should be done (if done in air) to avoid creating
solderability probs.
Some contract vendors can perform bake in a dry nitrogen environment at
high
temps avoiding the oxidation issues (or so they say...does anyone have
experience
with this?).

Rgds,
/John

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################