Alan et al,

  I am presently baking smt components, D2Pak.   We have had problems due
  to moisture entrappment.    Our concern is the tape and its adhesive.  If you
go
  too high with the temp the adhesive on the tape will dry and you end up with
  problems at  assembly.    The components themselves should not be a problem
  at the 100C temp, they should dry out just fine.   Just remember to cool down
so as
  not to produce condensation.   These are not hermetically sealed parts.
  So be careful what and how you do this dryout.  One thing I have found over
the
  years is with every action there is a reaction-where have I heard that before.

  Don Fumia





Alan Shaw <[log in to unmask]> on 09/14/99 04:34:13 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Alan Shaw <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Don Fumia/Aut/Schneider)
Subject:  [TN] Baking SOIC packages to dry them prior to reflow solder




I have 5 year old plastic SOIC packages on reels and want to dry them out in
an oven rather than leave it to the pre-heat of the reflow solder machine.
Production asked for temperature and time for the SOIC to be in the oven.
My initial thoughts are to put them in a cold oven and set the thermostat to
110'C and leave them baking for 4 hours. Then turn off the oven. Remove them
when cool and use in the insertion machines the next day.
Is the temperature and time suitable?

The leads have passed a solderability test already, would the time in the
oven have a significant effect on solderabitiy?

Al Shaw
ashaw at napcosecurity dot com

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