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September 1999

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Tue, 14 Sep 1999 18:55:31 -0400
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can you use dry nitrogen to bake out?
At 04:13 PM 9/14/99 -0500, you wrote:
>Al,
>Those are old parts.  Hmmm.   Although weight loss studies I have done and
>have seen from vendors show most of the moisture leaves components within
>the first four hours, these investigations have not been with parts that
>have had the possibility to suck up moisture for five years. (Well they
>wouldn't be doing it continuously.)  I personally would be a whole lot more
>comfortable with a 24 hour temperature soak, at the temperature you
>mentioned.  I would expect that at this temperature you should be OK with
>respect to growth of surface oxide, unless of course you are right on the
>hairy edge of your pass/fail criteria for solderability.  I would also be
>inclined to use them as soon as possible after they come out of the oven, as
>I have no idea how susceptible the particular SOICs you have are to moisture
>pick-up.
>
>regards,
>Bev Christian
>Nortel Networks
>
>
>> -----Original Message-----
>> From: Alan Shaw [SMTP:[log in to unmask]]
>> Sent: Tuesday, September 14, 1999 4:34 PM
>> To:   [log in to unmask]
>> Subject:      [TN] Baking SOIC packages to dry them prior to reflow solder
>>
>> I have 5 year old plastic SOIC packages on reels and want to dry them out
>> in
>> an oven rather than leave it to the pre-heat of the reflow solder machine.
>> Production asked for temperature and time for the SOIC to be in the oven.
>> My initial thoughts are to put them in a cold oven and set the thermostat
>> to
>> 110'C and leave them baking for 4 hours. Then turn off the oven. Remove
>> them
>> when cool and use in the insertion machines the next day.
>> Is the temperature and time suitable?
>>
>> The leads have passed a solderability test already, would the time in the
>> oven have a significant effect on solderabitiy?
>>
>> Al Shaw
>> ashaw at napcosecurity dot com
>>
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