TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
KELLY M SCHRIVER <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Sep 1999 17:07:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Al -

At a guess, I'd say there is a real good possibility that the tape adhesive
will turn loose at this temperature and leave you with a mess on your hands,
comprised of loose tape and parts.  You probably ought to try some samples
first.  It would probably be a good idea to consult the parts manufacturer to
lear the charactaristics of the molding compound used on that date code of
parts.  They should be able to tell you the level of moisture susceptibility
and preferred dehumidification routines.

Regards - Kelly

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2