Hi Donn,

What are you using to clean the bottom side of the stencil and how often do
you clean it ??

Manon Dutil
Product Manager
[log in to unmask]
819-569-9561 tel
819-569-8222 fax
-----Message d'origine-----
De : Steffen, Don E <[log in to unmask]>
À : [log in to unmask] <[log in to unmask]>
Date : 14 septembre, 1999 09:49
Objet : [TN] Alpha Metals UP-78


>Tech Netters
>
>We are experiencing a problem with lot to lot consistency with the Alpha
>Metals UP-78 Solder Paste. The printability from lot to lot is
inconsistent.
>Appears that the paste is drying out to soon. We do have Humidity controls
>on our DEK 265. Is there anyone else out there that is having the same
>problem? Could it be that this is a summer anomaly? The factory environment
>is 50%RH with 26C temperature. We are using a Multicore RP11, No Clean
>Solderpaste with no problem. All of our processes are being converted over
>to No Clean.
>
>Donn E Steffen
>Senior Quality Engineer
>VDO Control Systems
>Auburn, IN 46706
>Phone (219)925-8887
>Fax (219)925-8710
>Email: [log in to unmask]
>
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