Tech Netters

We are experiencing a problem with lot to lot consistency with the Alpha
Metals UP-78 Solder Paste. The printability from lot to lot is inconsistent.
Appears that the paste is drying out to soon. We do have Humidity controls
on our DEK 265. Is there anyone else out there that is having the same
problem? Could it be that this is a summer anomaly? The factory environment
is 50%RH with 26C temperature. We are using a Multicore RP11, No Clean
Solderpaste with no problem. All of our processes are being converted over
to No Clean.

Donn E Steffen
Senior Quality Engineer
VDO Control Systems
Auburn, IN 46706
Phone (219)925-8887
Fax (219)925-8710
Email: [log in to unmask]

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