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September 1999

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Subject:
From:
Poh Kong Hui <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Sep 1999 22:14:17 +0800
Content-Type:
text/plain
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text/plain (33 lines)
Hi Technetters,

I am encountering the issue that having solder balls that stucked inside
the via-holes, as this was caused by the cleaning the 'misprint' boards,
that the solder paste was somehow got into the via-holes by trying to scoop
the solder off the board.

Now, the problem is that the solder beads (from the paste) that stucked
inside the via-hole so stubbornly that I am not able to get them out.

We try to water-jet clean off the solder beads, it only manages to get rid
50% of them, and still there is 50% of ball/beads in the via-holes.

Any good advise that enable me to get the solder balls/beads out of the
via-holes completely.


Poh

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