TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
su-kyoung Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 9 Sep 1999 10:12:27 +0900
Content-Type:
text/plain
Parts/Attachments:
mail.txt (26 lines)
Hello, all
I have difficulty in Sn/Pb plating beacuse deviation of Sn/Pb thickness is severe.
and where the pattern is dense the deviation is more severe.  

Does anyone know the good way decrease the thickness deviation?
Is it possible to decrease the plating thickness deviation of the dense pattern part  

within +- 1зн?
I want to the way and the eqip, chemical ....
I'm waiting...
Good bye all  

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2