TECHNET Archives

September 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Glenn Pelkey <[log in to unmask]>
Reply To:
Date:
Tue, 7 Sep 1999 15:58:47 PDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (39 lines)
I found the following:

Jedec:
 Jedec 95-1, "Jedec Design Standard, Design Requirements for Outlines of Solid
State and Related Products"
JESD22 B-108, "Coplanarity Test for Surface-Mount Semiconductor Devices"

IPC:
IPC-7095, "Design and Assembly Process Implementation for BGAs"
(ot sure if it has been finalized yet)

Glenn

Ken Patel <[log in to unmask]> Wrote:
|
| What is the acceptable industry spec or IPC for QFP and BGA coplanarity?
|
| re,
| ken patel
|
| ______________________________________________________
| Ken Patel                       Phone:  (408) 490-6804
| 1708 McCarthy Blvd.             Fax:    (408) 490-6859
| Milpitas, CA 95035              Beeper: (888) 769-1808

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2