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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 6 Sep 1999 11:17:22 -0700 |
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Hi Nick:
Hans' explanation to this topic is excellent. I couldn't add anything but
would like to bring to your notice that Karl H. Dietz in his CircuiTree
Column "Tech Talk - Fine Lines in High yield (Part XLVIII): Quick Turn Shops
(August 1999)" and "(Part XXXVIII): Tent and Etch (Part 1) (October 1998)"
give panel and pattern plating processes some in-depth analyses. These are
very good articles.
Yu-Shan Han, Ph.D., P.E.
Lead One Technology, Inc.
Seattle, WA
(206) 368 - 8429
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Nicholas LAI
Sent: Tuesday, August 31, 1999 7:06 PM
To: [log in to unmask]
Subject: [TN] Plating and pattern plating
Hello
(1)What is the different between panel plating or pattern plating?
(2)More, I heard that there are two process flows to make the multiayer
baord on
plating.
One is PTH than Panel plating and then pattern plating.
Second is PTH than pattern plating(there is no panel platting.)
Which on is better and what is the pros & cons.
Best Regard,
Nicholas Lai
9/1/99
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