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September 1999

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Subject:
From:
"<Brian F. Griffith>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 4 Sep 1999 10:08:44 EDT
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text/plain
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text/plain (27 lines)
Susan -
The number of passes is very dependant on many factors. For instance, the
severity of the reflow profile can degrade OSP's. Also, any flux or paste
contact on the OSP finish will degrade the OSP. The OSP choice is also a
major factor. There are many OSP choices, from simple mono-molecular types,
like the Enthone CU-56 (typically good for one thermal excursion) to the more
robust imidiazoles and modified imidiazoles. These latter types are designed
to withstand multiple thermal cycles. The use of an inert atmosphere in the
reflow oven will be expected to allow more thermal passes as well. Enthone is
a leader in this technology. Hope this helps -
regards
Brian

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