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September 1999

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Subject:
SANYO E-CSP packages
From:
Matthias Mansfeld <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 1 Oct 1999 02:57:26 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (53 lines) 
HelloTechNetters,

at first please apologize crossposting in DC, Technet, PCD list.

Has anybody experiences (layout, assembly, soldering, reliability)
with SANYO E-CSP packages? These are very very small packages for
discrete semiconductors, little cubes with three Au plated pads
invisible on the bottom side. The type E-CSP 1006 is about 1 mm long,
0.6 mm wide and 0.5 mm high, the "big" pad is 0.5 mm x 0.275 mm, the
two smaller pads are 0.15 x 0.275 mm, distance is about 0.2 mm.

My questions: Any experiences with layout (pad sizes?), solder paste
dispensing or printing (or any other methods for solder deposit -
pre-tinning, SIPAD, HighPAD etc.), with reflow soldering, rework and
long term reliability (preferred automotive temperature range).

SANYO has only this one URL with rather poor informations:
http://semic.sanyo.co.jp/english/news/801210tr-e.html
no app-notes, no dimensioned drawings, no links to any documentation.

A customer (a burn-in and test lab) got these parts without many
comments on his desk "fry them at 200° C over 1000 hours or til they
are dead, what ever happens first" and now he needs any solution to
get this stuff more or less reliable on some burn-in boards.

Any help is highly appreciated..
Regards
Matthias Mansfeld



-----------------------------------------------
Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
E-Mail: [log in to unmask]
Internet: http://www.mansfeld-elektronik.de

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