> From:  C. P. Chien            Boeing > ->  Phantom Works
>
> To:  Technet Distribution
>
> I am with the Phantom Works Organization at the Boeing Company in Seattle, WA.  We are currently working on an Air Force contract under the Reliability Prediction and Validation Program.  One of the goals of this program is to enhance and validate interconnect structure (lead and solder joint) durability and reliability modeling tools with commercial field failure data and designed experiments.
>
> We are currently collecting field failure data and are soliciting inputs from industry.  Our analysis will include both old and new assembly technologies:  PTH, SMT (chip, leaded and leadless devices), Ball Grid Array, Chip Scale Packages and Flip Chip applications.  We are looking specifically for data related to failure modes seen on these components during actual use (ie. failures seen on returned hardware).  Also of interest would be failure modes seen during accelerated life testing (vibration, thermal shock, etc.)
>
> Each company that is  willing to contribute data to the survey will receive a copy of the results compiled from all responses.  Please note that we will hold any information gathered in strictest confidence, and that the compiled results will be anonymous with respect to information sources.  We would like initial responses within 2-3 weeks, at which time we will follow-up with telecons or on-site visits as needed.
>
> If you are interested, please fill out the attached questionnaire and return to us via email (preferred), fax or mail.   (We have attached the survey in Rich-Text-Format and MSWord format for your convenience).  If you are aware of any other person who would be interested in this activity, you are welcome to forward to this message
>
>               Email: [log in to unmask]
>
>       Fax:    (253)657-8903; Attn:  Dan Kovach
>
>               Mail:   Boeing Company
>               Phantom Works
>               PO Box 3999 MC 3W-50
>               Seattle, WA  98124-2499
>               Attn:  Dan Kovach
>
> If you have any questions, please contact Dan by Email or by phone at (253)657-5767.
>
> Thank You,
>
> Chung-Ping Chien
> Manager, Sensors & Microsystems > ->  Micro Packaging
>
> >  <<Survey.doc>> > >  <<Survey.rtf>>
> ---------------------------------------------------------
> Jim Maguire
> Associate Technical Fellow
> Boeing Phantom Works
> E/E M&P
> Phone (253)657-9063
> fax       (253)657-8903
> NEW PAGER (206)797-9290
> email:  [log in to unmask]
> ---------------------------------------------------------
>
>