Jason,

        Are you speaking of surface or insertion mount solder joints? Are
you concerned about assembly issues (ie, will the joint fail during
wave solder), defect issues (will I create a void or a crack during
my process), or lifetime issues (what is the optimum size/shape for
long life?).
        At CALCE we have a number of simulation tools that might be able to
help you with your query. Send me more information about what
inputs you have and what outputs you are interested in.

Regards,
Craig


> Is there anywhere I can obtain a model for predicting the life, strength, etc.
> of a solder joint?  I would like to be able to input data one of two ways to
> determine what I can expect.
>
> 1.  Can I input characteristics of the joint into some type of matrix i.e, hole
> size, plating thk, hole fill, fillet concavity, and get a life prediction model?
>
> 2.  From FEM, obtain predicted overall stress and strain for the joint then
> extrapolate out into some life prediction model for reliability.
>
> My primary concern are joints on the bottomside of a PCB either from wave solder
> or the paste-in-hole process.  I would appreciate direction or something
> another.
>
> Jason Smith
> Process Materials Engineer
> Lexmark Electronics
>
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Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

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