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September 1999

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Subject:
From:
Chris Robertson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Sep 1999 15:48:13 -0500
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Al,
Is a cold oven, an oven with a cooling core inside?
I have used a environmental chamber, which has a cooling core that dried
my material with out heat. Kinda like the defroster on your car.

Chris Robertson
PCB Designer
Lockheed - Martin Services, Inc.
[log in to unmask]
Ph/Fax (256) 722-2626
ICQ# 13541566



----- Original Message -----
From: TechNet E-Mail Forum. Alan Shaw
<[log in to unmask]@NAPCOSECURITY.COM>
To: <[log in to unmask]>
Sent: Tuesday, September 14, 1999 4:34 PM
Subject: [TN] Baking SOIC packages to dry them prior to reflow solder


I have 5 year old plastic SOIC packages on reels and want to dry them out in
an oven rather than leave it to the pre-heat of the reflow solder machine.
Production asked for temperature and time for the SOIC to be in the oven.
My initial thoughts are to put them in a cold oven and set the thermostat to
110'C and leave them baking for 4 hours. Then turn off the oven. Remove them
when cool and use in the insertion machines the next day.
Is the temperature and time suitable?

The leads have passed a solderability test already, would the time in the
oven have a significant effect on solderabitiy?

Al Shaw
ashaw at napcosecurity dot com

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