Hi Technet,

I'm having some problems lately with soldering of pcb's with an electroless nickel/ immersion gold conductor finishing, which brings me (after some discussions with our board supplier) to the following questions :
Is solderability influenced by pre-baking the boards ? Does the first soldering step have an effect on solderability for the second soldering step (double sided reflow) ? How about the time between all these thermal excursions ? 
Is it possible that a solder paste that performs excellent with HASL-boards (and normally also with immersion gold boards) is a bad choice for soldering to immersion gold ?

Greetings,

Daan Terstegge
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