From a hybrid IC manufacturing standpoint most will not ultrasonically clean
any component having an un-filled, internal cavity with wire bonds therein.
This would include crystals, oscillators, hermetic packages, reed switches,
etc  (The reed switch was an afterthought based on some pacemaker info
related to contact fretting - no wire bonds)

We have ultrasonically cleaned un-sealed devices where the cleaning solution
is in contact with (surrounds/immersed in) the wires, with no deleterious
effects.

Others are correct, the newer variable sweep frequency transducers/systems
are better at reducing the potential for damage, but caution may be best
here ...

"trust by verify"


Steve

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