Hi David,
Thanks for the plug - that booklet 734 is #25 (~$38) if anyone is
interested.
I am also hoping to discuss the question of a standard test method for tin
whisker growth with a number of people (including Yun Zhang at Lucent) as
this question has been raised a number of times recently.
Growth can be affected by temperature, humidity, coating stress etc. So in
some cases it is good to test coatings under tension or compression on
deformed substrates.
If anyone has any comments/preferences on possible tests then please send
them directly to me.
thanks
Kay Nimmo
+++++ Visit our lead-free.org website +++++
ITRI Ltd, Kingston Lane, Uxbridge, Middx, UK, UB8 3PJ
tel: +44 (0)1895 272406 fax: +44 (0)1895 251841
email: [log in to unmask] www.itri.co.uk and www.lead-free.org
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: 03 September 1999 22:41
To: [log in to unmask]
Subject: Re: [LF] Whiskers Problem on Leadframes
Hi Stephane! Just to back up what Mel Parish alluded to - take a look at
International Tin Research Institute publication number 734 "The Growth of
Tin Whiskers" authored by Dr. Paul Harris. The publication contains a
wealth of data that is still valid in today's world and gives some
potential methods of preventing whisker growth/regrowth. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
Stephane Menard <[log in to unmask]> on 09/03/99 06:09:04 AM
Please respond to "Leadfree Electronics Assembly E-Mail Forum."
<[log in to unmask]>; Please respond to [log in to unmask]
To: [log in to unmask]
cc:
Subject: [LF] Whiskers Problem on Leadframes
Hi everybody !!
I have a question regarding the well known problem of whiskers generation
on
leadframes.
With the concept of lead free deposit and the investigation of several
alternatives (Sn-Bi, Sn-Ag, Pure Tin, etc..) to Tin-Lead, we need to
study
the risk of generation of whiskers with those substitutes.
It is generally agreed that Tin alloys (even at low percentage in the other
metal) are not prone to this problem whereas pure Tin deposits are.
However, does anybody have a recognized method (electrochemical, physical,
etc...) which could help in predicting the apparition, or not, of this
problem (besides the standard aging test which sometimes can be quite
doubtful !) ?
I am looking forward to your answers and comments.
Sincerely,
Stephane Menard
Micropulse Plating Concepts
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