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Date: | Wed, 22 Sep 1999 10:48:13 -0500 |
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All,
Several of the Pb-free options being offered for use in both solders and
component lead plating include silver (Ag), for example Sn/Ag. In the past
some users of IC components have had concerns/problems with use of Ag in
components because of silver dendrite growth. Is there any concern about
use of Ag in these Pb-free alternatives? If not please provide a brief
technical explanation of why not.
This question may have been raised previously, but I can't find the answer.
Best regards, Doug Romm
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