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September 1999

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Subject:
From:
Karl Bates <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 23 Sep 1999 07:55:19 -0500
Content-Type:
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Matthias,
I don't know if this is the same package or not (MPC8260ZUXX), but there
seems to be a moisture sensitivity issue with this part.   I don't know
if this concerns you or not.

Karl

On follow-up with factory, this package, ZU, taped plastic ball grid
array, is
not expected to improve to Level 3(7 days out of bag), from Level 4(3
days out
of bag), in the near future, or even in YR 2000.  The "ZU" is the only
package
it will be offered in.  The parts in "XPC" version will be in production
Q3'99
at Level 4.

The ZU package is a plastic layer, metal layer, then plastic layer.  The
metal
layer is for heat sink, and as such, a bit of the metal extends beyond
the
plastic it is "sandwiched" between, therefore allowing for a chance of
moisture penetration.

Matthias Mansfeld wrote:

> Hello Designers,
>
> At first, please apologize cross-posting in DC, Technet and PCD list.
> It's a design AND assembly question.
>
> I have a Motorola MPC8260, in a BGA package TBGA480 37,5 x
> 37,5 (BGA with 480 balls in 5 rows, means 29x29 Matrix with 19x19
> free) with pitch 1,27 mm. The customer wants 3 prototype boards -
> means many profile tests or other scrap producing operatiins are not
> possible.
>
> Has anybody out there any good application notes or a URL at Motorola
> which goes especially to this package (I searched until I died, but
> found nothing special) or own good/bad experiences concerning layout
> and assembly?
>
> Has anybody experiences with "low-cost" BGA sockets from E-tec or
> other companies, especially with the E-Tec "screw-lock" solderless
> compression types (double-sided spring contacts between BGA & board
> with a standard BGA layout)? Any good/bad EMV experiences
> (signal/clock integrity) for higher clocked devices in these sockets?
> etc.
>
> Many thanks in advance, regards
> Matthias Mansfeld
> -----------------------------------------------
> Matthias Mansfeld Elektronik
> * Printed Circuit Board Design and Assembly
> Am Langhoelzl 11, D-85540 Haar, GERMANY
> Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
> E-Mail: [log in to unmask]
> Internet: http://www.mansfeld-elektronik.de


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